Invention Grant
- Patent Title: Provide heat to end regions of a printhead die
- Patent Title (中): 向打印头芯片的端部区域提供热量
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Application No.: US13967917Application Date: 2013-08-15
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Publication No.: US08991983B2Publication Date: 2015-03-31
- Inventor: Michael Hager , Lawrence H White , Alexander N Govyadinov
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: Hewlett-Packard Patent Department
- Main IPC: B41J2/05
- IPC: B41J2/05 ; B41J2/14 ; B41J2/045

Abstract:
A printhead die includes end regions, a nozzle surface region, fluid passages, ejection chambers, fluid ejectors, non-ejection chambers, and heating resistors. The nozzle surface region is disposed between the end regions. The fluid passages include corresponding ejection nozzles. The ejection nozzles are disposed on the nozzle surface region. The fluid ejectors correspond to the ejection chambers. Each one of the fluid ejectors selectively ejects printing fluid through a corresponding ejection nozzle. The plurality of heating resistors corresponds to the non-ejection chambers. The heating resistors selectively provide heat to the end regions while not ejecting printing fluid through the ejection nozzles.
Public/Granted literature
- US20150049142A1 PROVIDE HEAT TO END REGIONS OF A PRINTHEAD DIE Public/Granted day:2015-02-19
Information query
IPC分类: