An electrical splice assembly includes a housing having a forward portion, a rearward portion, and an intermediate portion defining a plurality of terminal retention cavities between the forward portion and the rearward portion. A conductive bus plate is retained within the forward portion of the housing. A plurality of terminals each extend into a respective terminal retention cavity and each terminal is in electrical contact with the bus plate. Each of the terminal retention cavities is defined by 1) a pair of opposing sidewalls connected to the forward portion and to the rearward portion and 2) a pair of opposing retention beams. The retention beams each include a latch which engages a respective terminal to retain the terminals in the terminal retention cavities.