Invention Grant
- Patent Title: Receptacle assembly for a midplane connector system
- Patent Title (中): 用于中平面连接器系统的插座组件
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Application No.: US13718137Application Date: 2012-12-18
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Publication No.: US08992252B2Publication Date: 2015-03-31
- Inventor: Justin Shane McClellan , Jeffrey Byron McClinton , James Lee Fedder , Justin Pickel , Timothy Robert Minnick , Dharmendra Saraswat , Alex Michael Sharf
- Applicant: Tyco Electronics Corporation
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01R13/648
- IPC: H01R13/648 ; H01R13/6581 ; H01R13/6587

Abstract:
A receptacle assembly includes a contact module having a conductive holder and a frame assembly received in the conductive holder and electrically shielded by the conductive holder. The frame assembly has a plurality of receptacle signal contacts having mating portions extending from the conductive holder. The receptacle signal contacts are arranged in differential pairs carrying differential signals. Ground shields are received in the conductive holder between the frame assembly and the conductive holder. The ground shields have grounding beams extending along the mating portions of the receptacle signal contacts. The grounding beams are arranged on four sides of each differential pair of the receptacle signal contacts.
Public/Granted literature
- US20130288525A1 RECEPTACLE ASSEMBLY FOR A MIDPLANE CONNECTOR SYSTEM Public/Granted day:2013-10-31
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