Invention Grant
- Patent Title: Methods of forming a thin layer and methods of manufacturing a phase change memory device using the same
- Patent Title (中): 形成薄层的方法和使用其制造相变存储器件的方法
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Application No.: US14189053Application Date: 2014-02-25
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Publication No.: US08993441B2Publication Date: 2015-03-31
- Inventor: Do-Hyung Kim , Eun-Tae Kim , Sung-Lae Cho
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2013-0026885 20130313
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L45/00

Abstract:
A method of forming a thin layer and a method of manufacturing a phase change memory device, the method of forming a thin layer including providing a first deposition source onto a substrate, the first deposition source not including tellurium; and providing a second deposition source onto the substrate, the second deposition source including a first tellurium precursor represented by the following Formula 1 and a second tellurium precursor represented by following the Formula 2: Te(CH(CH3)2)2 Formula 1 Ten(CH(CH3)2)2 Formula 2 wherein, in Formula 2, n is an integer greater than or equal to 2.
Public/Granted literature
- US20140273395A1 METHODS OF FORMING A THIN LAYER AND METHODS OF MANUFACTURING A PHASE CHANGE MEMORY DEVICE USING THE SAME Public/Granted day:2014-09-18
Information query
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