Invention Grant
- Patent Title: Systems of an electronic device and methods for manufacturing the same
- Patent Title (中): 电子装置的系统及其制造方法
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Application No.: US14248150Application Date: 2014-04-08
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Publication No.: US08993899B2Publication Date: 2015-03-31
- Inventor: Shayan Malek , Benjamin J. Pope , Daniel W. Jarvis , Tang Yew Tan , Richard H. Dinh , Robert J. Steinfeld , Ramachandran Chundru
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H04M1/02 ; H04N5/225 ; H05K1/02

Abstract:
Various systems of an electronic deice and methods for manufacturing the same are provided. In some embodiments, a routing assembly is provided that may not only route a cable along a circuit board, but that may also shield and electronic component or secure an electronic component to the circuit board. In some other embodiments, there is provided a mechanism for electrically coupling two components of an electronic device that may also be visually appealing in the context of other portions of the electronic device.
Public/Granted literature
- US20140218606A1 SYSTEMS OF AN ELECTRONIC DEVICE AND METHODS FOR MANUFACTURING THE SAME Public/Granted day:2014-08-07
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