发明授权
- 专利标题： Chip resistor and method of manufacturing the same
- 专利标题（中）： 贴片电阻及其制造方法
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申请号： US13716982申请日： 2012-12-17
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公开(公告)号： US08994491B2公开(公告)日： 2015-03-31
- 发明人: Yong Min Kim , Jung Il Kim , Ichiro Tanaka , Young Tae Kim , Heun Ku Kang
- 申请人： Samsung Electro-Mechanics Co., Ltd.
- 申请人地址： KR Suwon, Gyunggi-Do
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Suwon, Gyunggi-Do
- 代理机构： McDermott Will & Emery LLP
- 优先权： KR10-2012-0090322 20120817
- 主分类号： H01C1/012
- IPC分类号： H01C1/012 ; H01C7/00 ; H01C17/00 ; H01C17/065
摘要：
There are provided a chip resistor and a method of manufacturing the same. The chip resistor includes a ceramic substrate; an adhesion portion formed on a surface of the ceramic substrate; and a resistor formed on the adhesion portion, wherein the adhesion portion includes at least one of copper (Cu), nickel (Ni), and copper-nickel (Cu—Ni).
公开/授权文献
- US20140049358A1 CHIP RESISTOR AND METHOD OF MANUFACTURING THE SAME 公开/授权日：2014-02-20
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