Invention Grant
- Patent Title: Electronic device housing and assembly method
- Patent Title (中): 电子设备外壳和组装方法
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Application No.: US13799282Application Date: 2013-03-13
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Publication No.: US08995125B2Publication Date: 2015-03-31
- Inventor: Yoshimichi Matsuoka , Michael James Louris , Jeffrey Hayashida , Jack Wanderman
- Applicant: Google Inc.
- Applicant Address: US CA Mountain View
- Assignee: Google Inc.
- Current Assignee: Google Inc.
- Current Assignee Address: US CA Mountain View
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: G06F1/16
- IPC: G06F1/16 ; B29C45/44

Abstract:
An electronic device includes a first housing of a single piece of material that has first and second spaced apart major walls that extend in lateral directions and at least three side walls extending perpendicular to the lateral directions between the major walls. The major walls and the side walls define an internal cavity, and the first housing defines an opening to the internal cavity opposite one of the side walls. At least one support member is within the internal cavity of the first housing adjacent a major walls a side wall thereof. At least one electronic component is contained within the internal cavity, and a first cover is removably affixed over the opening. At least one of the support member and the first cover contributes to a retention force applied on the at least one electronic component within the internal cavity of the first housing.
Public/Granted literature
- US20140043744A1 ELECTRONIC DEVICE HOUSING AND ASSEMBLY METHOD Public/Granted day:2014-02-13
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