Invention Grant
- Patent Title: Liquid ejecting head, liquid ejecting apparatus
- Patent Title (中): 液体喷射头,液体喷射装置
-
Application No.: US14100291Application Date: 2013-12-09
-
Publication No.: US08998380B2Publication Date: 2015-04-07
- Inventor: Yuma Fukuzawa , Hiroshige Owaki
- Applicant: Seiko Epson Corporation
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2012-271110 20121212
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16 ; B41J2/045

Abstract:
A liquid ejecting head includes a nozzle plate, a flow path forming substrate, and a communication plate between the nozzle plate and the substrate and having a communication hole connecting a nozzle and a first opening of a pressure chamber. The first opening extends in a direction perpendicular to an arrangement direction of the pressure chambers. The first opening has a narrowed portion close to the communication hole. The communication hole has at least three edge lines which extend in a penetration direction. The communication plate is bonded to the substrate such that the ends of the edge lines at a surface close to the substrate are covered with the substrate that defines the narrowed portion on a surface close to the communication plate.
Public/Granted literature
- US20140160204A1 LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS Public/Granted day:2014-06-12
Information query
IPC分类: