Invention Grant
- Patent Title: Interconnect assembly
- Patent Title (中): 互连组件
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Application No.: US13752606Application Date: 2013-01-29
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Publication No.: US08998636B2Publication Date: 2015-04-07
- Inventor: Adolfo Adolfo Gomez , Tom J. Searby
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: Hewlett-Packard Patent Department
- Main IPC: H01R11/00
- IPC: H01R11/00 ; H01R31/06 ; H01R27/02

Abstract:
An interconnect assembly and system are disclosed herein. An example of the interconnect assembly includes a first signal connector and a second signal connector. The example also includes a combination connector coupled to the first signal connector and the second signal connector. The example further includes a power bus coupled to the combination connector to supply power to the combination connector. Other elements, components, and features of the interconnect assembly are disclosed herein as are alternative examples of interconnect assemblies. Elements, components, and features of the system are also disclosed herein as are alternative examples of the system.
Public/Granted literature
- US20140213101A1 INTERCONNECT ASSEMBLY Public/Granted day:2014-07-31
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