Invention Grant
US08999763B2 Package including an interposer having at least one topological feature
有权
包括具有至少一个拓扑特征的插入器的封装
- Patent Title: Package including an interposer having at least one topological feature
- Patent Title (中): 包括具有至少一个拓扑特征的插入器的封装
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Application No.: US14300130Application Date: 2014-06-09
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Publication No.: US08999763B2Publication Date: 2015-04-07
- Inventor: Steven Eskildsen , Aravind Ramamoorthy
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/56 ; H01L23/31 ; H01L23/495 ; H01L23/00
Abstract:
Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, having an interposer including at least one topological feature, such as a depression in a surface of the interposer, a die coupled to the surface of the interposer, and an encapsulant material formed over the die and the interposer, and disposed in the at least one depression to resist movement of the encapsulant material relative to the interposer. Other embodiments may be described and claimed.
Public/Granted literature
- US20140287558A1 PACKAGE INCLUDING AN INTERPOSER HAVING AT LEAST ONE TOPOLOGICAL FEATURE Public/Granted day:2014-09-25
Information query
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