Invention Grant
- Patent Title: Fin-type semiconductor device
- Patent Title (中): 鳍型半导体器件
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Application No.: US13834594Application Date: 2013-03-15
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Publication No.: US08999792B2Publication Date: 2015-04-07
- Inventor: Xia Li , Bin Yang , Stanley Seungchul Song
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Toler Law Group, PC
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/786 ; G06F17/50 ; H01L21/8234 ; H01L29/66 ; H01L29/78

Abstract:
An apparatus comprises a substrate and a fin-type semiconductor device extending from the substrate. The fin type semiconductor device comprises a fin that comprises a first region having a first doping concentration and a second region having a second doping concentration. The first doping concentration is greater than the second doping concentration. The fin type semiconductor device also comprises an oxide layer. Prior to source and drain formation of the fin-type semiconductor device, a doping concentration of the oxide layer is less than the first doping concentration.
Public/Granted literature
- US20140264485A1 FIN-TYPE SEMICONDUCTOR DEVICE Public/Granted day:2014-09-18
Information query
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