Invention Grant
- Patent Title: Multi-gate field-effect transistor process
- Patent Title (中): 多栅极场效应晶体管工艺
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Application No.: US14306250Application Date: 2014-06-17
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Publication No.: US08999793B2Publication Date: 2015-04-07
- Inventor: Chin-I Liao , Chia-Lin Hsu , Ming-Yen Li , Yung-Lun Hsieh , Chien-Hao Chen , Bo-Syuan Lee
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/10

Abstract:
A Multi-Gate Field-Effect Transistor includes a fin-shaped structure, a gate structure, at least an epitaxial structure and a gradient cap layer. The fin-shaped structure is located on a substrate. The gate structure is disposed across a part of the fin-shaped structure and the substrate. The epitaxial structure is located on the fin-shaped structure beside the gate structure. The gradient cap layer is located on each of the epitaxial structures. The gradient cap layer is a compound semiconductor, and the concentration of one of the ingredients of the compound semiconductor has a gradient distribution decreasing from inner to outer. Moreover, the present invention also provides a Multi-Gate Field-Effect Transistor process forming said Multi-Gate Field-Effect Transistor.
Public/Granted literature
- US20140295634A1 MULTI-GATE FIELD-EFFECT TRANSISTOR PROCESS Public/Granted day:2014-10-02
Information query
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