发明授权
US09000633B2 Drive apparatus having a motor, a heat sink, and a plurality of semiconductor modules
有权
具有马达，散热器和多个半导体模块的驱动装置
- 专利标题： Drive apparatus having a motor, a heat sink, and a plurality of semiconductor modules
- 专利标题（中）： 具有马达，散热器和多个半导体模块的驱动装置
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申请号： US13379096申请日： 2010-06-23
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公开(公告)号： US09000633B2公开(公告)日： 2015-04-07
- 发明人: Masashi Yamasaki , Atsushi Furumoto , Hideki Kabune
- 申请人： Masashi Yamasaki , Atsushi Furumoto , Hideki Kabune
- 申请人地址： JP Kariya
- 专利权人： Denso Corporation
- 当前专利权人： Denso Corporation
- 当前专利权人地址： JP Kariya
- 代理机构： Nixon & Vanderhye P.C.
- 优先权： JP2009149650 20090624; JP2010014393 20100126; JP2010117683 20100521
- 国际申请： PCT/JP2010/004158 WO 20100623
- 国际公布： WO2010/150529 WO 20101229
- 主分类号： H02K11/04
- IPC分类号： H02K11/04 ; H02K11/00 ; B62D5/04 ; H02K5/22
摘要：
A heat sink has two heat radiation blocks. The heat radiation block is formed in a wide column shape. The heat radiation block has connection parts at both ends. The connection parts have respective holes formed to pass through in the axial direction of a motor. One screw is inserted in one connection part and threaded into a motor case. The other screw is inserted in the other connection part and threaded into the motor case together with a cover. A power module forming an inverter circuit of each of two power supply systems is arranged on each heat radiation blocks.
公开/授权文献
- US20120098361A1 DRIVE APPARATUS 公开/授权日：2012-04-26
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