A manufacturing method includes providing a substrate with an outer surface and at least one interior space and machining the substrate to selectively remove a portion of the substrate and define one or more cooling supply holes therein. Each of the one or more cooling supply holes is in fluid communication with the at least one interior space. The method further includes disposing an open cell porous metallic layer on at least a portion of the substrate. The open cell porous metallic layer is in fluid communication with the one or more cooling supply holes. A coating layer is disposed on the open cell porous metallic layer. The coating layer having formed therein one or more cooling exit holes in fluid communication with the open cell porous metallic layer. The substrate, the one or more cooling supply holes, the open cell porous metallic layer and the cooling exit holes providing a cooling network for a component.