发明授权
- 专利标题： Conductive micro-wire structure
- 专利标题（中）： 导电微线结构
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申请号： US13751464申请日： 2013-01-28
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公开(公告)号： US09005744B2公开(公告)日： 2015-04-14
- 发明人: John Andrew Lebens , David Paul Trauernicht , Yongcai Wang , Ronald Steven Cok
- 申请人： John Andrew Lebens , David Paul Trauernicht , Yongcai Wang , Ronald Steven Cok
- 申请人地址： US NY Rochester
- 专利权人： Eastman Kodak Company
- 当前专利权人： Eastman Kodak Company
- 当前专利权人地址： US NY Rochester
- 代理商 Raymond L. Owens
- 主分类号： B32B27/32
- IPC分类号： B32B27/32 ; G11B11/105 ; H05K1/00 ; H05K1/02
摘要：
A conductive micro-wire structure includes a substrate. A plurality of spaced-apart electrically connected micro-wires is formed on or in the substrate forming the conductive micro-wire structure. The conductive micro-wire structure has a transparency of less than 75% and greater than 0%.
公开/授权文献
- US20140209359A1 CONDUCTIVE MICRO-WIRE STRUCTURE 公开/授权日：2014-07-31
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