发明授权
US09006027B2 Systems and methods for terminating junctions in wide bandgap semiconductor devices 有权
用于在宽带隙半导体器件中终止结的系统和方法

Systems and methods for terminating junctions in wide bandgap semiconductor devices
摘要:
An electrical device includes a blocking layer disposed on top of a substrate layer, wherein the blocking layer and the substrate layer each are wide bandgap semiconductors, and the blocking layer and the substrate layer form a buried junction in the electrical device. The device comprises a termination feature disposed at a surface of the blocking layer and a filled trench disposed proximate to the termination feature. The filled trench extends through the blocking layer to reach the substrate layer and is configured to direct an electrical potential associated with the buried junction toward the termination feature disposed near the surface of the blocking layer to terminate the buried junction.
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