Invention Grant
- Patent Title: High sheet resistor in CMOS flow
- Patent Title (中): CMOS流程中的高片电阻
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Application No.: US14050935Application Date: 2013-10-10
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Publication No.: US09006838B2Publication Date: 2015-04-14
- Inventor: Rajni J. Aggarwal , Jau-Yuann Yang
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Jacqueline J. Garner; Frank Cimino
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L27/06

Abstract:
An integrated circuit containing CMOS gates and a counterdoped polysilicon gate material resistor which has a body region that is implanted concurrently with the NSD layers of the NMOS transistors of the CMOS gates and concurrently with the PSD layers of the PMOS transistors of the CMOS gates, and has a resistor silicide block layer over the body region which is formed of separate material from the sidewall spacers on the CMOS gates. A process of forming an integrated circuit containing CMOS gates and a counterdoped polysilicon gate material resistor which implants the body region of the resistor concurrently with the NSD layers of the NMOS transistors of the CMOS gates and concurrently with the PSD layers of the PMOS transistors of the CMOS gates, and forms a resistor silicide block layer over the body region of separate material from the sidewall spacers on the CMOS gates.
Public/Granted literature
- US20140035061A1 HIGH SHEET RESISTOR IN CMOS FLOW Public/Granted day:2014-02-06
Information query
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