Invention Grant
US09006845B2 MEMS device with polymer layer, system of a MEMS device with a polymer layer, method of making a MEMS device with a polymer layer
有权
具有聚合物层的MEMS器件，具有聚合物层的MEMS器件的系统，制备具有聚合物层的MEMS器件的方法
- Patent Title: MEMS device with polymer layer, system of a MEMS device with a polymer layer, method of making a MEMS device with a polymer layer
- Patent Title (中): 具有聚合物层的MEMS器件，具有聚合物层的MEMS器件的系统，制备具有聚合物层的MEMS器件的方法
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Application No.: US13743300Application Date: 2013-01-16
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Publication No.: US09006845B2Publication Date: 2015-04-14
- Inventor: Alfons Dehe
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies, A.G.
- Current Assignee: Infineon Technologies, A.G.
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L29/84
- IPC: H01L29/84 ; B81B3/00 ; B81C1/00
Abstract:
A MEMS device, a method of making a MEMS device and a system of a MEMS device are shown. In one embodiment, a MEMS device includes a first polymer layer, a MEMS substrate disposed on the first polymer layer and a MEMS structure supported by the MEMS substrate. The MEMS device further includes a first opening disposed in the MEMS substrate and a second opening disposed in the first polymer layer.
Public/Granted literature
Information query
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