发明授权
- 专利标题： Package for a micro-electro mechanical device
- 专利标题（中）： 微电机械装置的包装
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申请号： US12262288申请日： 2008-10-31
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公开(公告)号： US09006877B2公开(公告)日： 2015-04-14
- 发明人: Don Michael , Mari J. Rossman , Bradley Bower , Charles Craig Haluzak , John R. Sterner , Quan Qi , John Kane
- 申请人： Don Michael , Mari J. Rossman , Bradley Bower , Charles Craig Haluzak , John R. Sterner , Quan Qi , John Kane
- 申请人地址： US TX Houston
- 专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人地址： US TX Houston
- 代理机构： Hewlett-Packard Patent Department
- 主分类号： H01L23/22
- IPC分类号： H01L23/22 ; B81C1/00
摘要：
A package for a micro-electromechanical device (MEMS package) includes an inner enclosure having an inner cavity defined therein, and a fill port channel communicating with the inner cavity and of sufficient length to allow a quantity of adhesive to enter the fill port channel while preventing the adhesive from entering the inner cavity.
公开/授权文献
- US20090057790A1 PACKAGE FOR A MICRO-ELECTRO MECHANICAL DEVICE 公开/授权日：2009-03-05
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