Invention Grant
- Patent Title: Insulator for a feedthrough
- Patent Title (中): 绝缘子用于馈通
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Application No.: US14175812Application Date: 2014-02-07
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Publication No.: US09008779B2Publication Date: 2015-04-14
- Inventor: Kengo Morioka , Keiichi Fujii , Arne Knudsen , Shingo Satou , Hidekazu Otomaru , Hiroshi Makino , Andrew Thom , Markus Reiterer , Gordon Munns , Thomas Miltich , Joyce Yamamoto
- Applicant: Kyocera Corporation , Medtronic, Inc.
- Applicant Address: US MN Minneapolis JP Kyoto
- Assignee: Medtronic, Inc.,Kyocera Corporation
- Current Assignee: Medtronic, Inc.,Kyocera Corporation
- Current Assignee Address: US MN Minneapolis JP Kyoto
- Agency: Foley & Lardner LLP
- Main IPC: A61N1/37
- IPC: A61N1/37 ; H02G3/22 ; A61N1/375

Abstract:
A hermetic feedthrough for an implantable medical device includes an insulator body and a ferrule. The insulator body includes ceramic material and one or more electrically conductive conduits extending through the insulator body. The insulator is disposed in an opening of the ferrule. The insulator body includes a plurality of substantially flat surfaces that each include a plurality of edges. A rounded corner extends between adjacent edges of any two adjacent substantially flat surfaces. Each corner between any two adjacent substantially flat surfaces that face toward the ferrule has an average radius that is less than approximately 25% of a length of the corresponding edges.
Public/Granted literature
- US20140151114A1 INSULATOR FOR A FEEDTHROUGH Public/Granted day:2014-06-05
Information query
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