Invention Grant
- Patent Title: Microetching solution for copper, replenishment solution therefor and method for production of wiring board
- Patent Title (中): 铜的微蚀刻解决方案及其配线方法
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Application No.: US14360783Application Date: 2013-06-25
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Publication No.: US09011712B2Publication Date: 2015-04-21
- Inventor: Masayo Kurii , Kiyoto Tai , Mami Nakamura , Yuki Ogino
- Applicant: Mec Company Ltd.
- Applicant Address: JP Hyogo
- Assignee: Mec Company Ltd.
- Current Assignee: Mec Company Ltd.
- Current Assignee Address: JP Hyogo
- Agency: Wenderoth, Lind & Ponack, LLP
- Priority: JP2012-216235 20120928
- International Application: PCT/JP2013/067365 WO 20130625
- International Announcement: WO2013/187537 WO 20131219
- Main IPC: C09K13/00
- IPC: C09K13/00 ; C23F1/18 ; H05K3/38 ; H05K3/06

Abstract:
Disclosed is a microetching solution, a replenishment solution added to said microetching solution and a method for production of a wiring board using said microetching solution. The microetching solution for copper consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, a polymer and a nonionic surfactant. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. In the microetching solution of the present invention, a value of A/B is 2000 to 9000 and a value of A/D is 500 to 9000, where a concentration of the halide ion is A % by weight, a concentration of the polymer is B % by weight and a concentration of the nonionic surfactant is D % by weight. Using this microetching solution, adhesion to a resin or the like can be uniformly maintained even with a low etching amount.
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