Invention Grant
- Patent Title: Hole transport materials
- Patent Title (中): 空孔运输材料
-
Application No.: US12129729Application Date: 2008-05-30
-
Publication No.: US09012037B2Publication Date: 2015-04-21
- Inventor: Gary A. Johansson , Eric Maurice Smith , Daniel David Lecloux
- Applicant: Gary A. Johansson , Eric Maurice Smith , Daniel David Lecloux
- Applicant Address: US DE Wilmington
- Assignee: EI du Pont de Nemours and Company
- Current Assignee: EI du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: H01L51/52
- IPC: H01L51/52 ; C07C211/57 ; C07C211/54 ; C07C211/58 ; H01L51/00

Abstract:
There is provided a hole transport compound having Formula I or Formula II: Ar1 is the same or different at each occurrence and can be phenylene, naphthylene, or binaphthylene. Ar2 is the same or different at each occurrence and can be phenyl, biphenyl, terphenyl, naphthyl, or binaphthyl. m and n are the same or different and are an integer greater than 0. T is the same or different at each occurrence and is a conjugated moiety including at least one triarylamino group. The T moiety is connected in a non-planar configuration.
Public/Granted literature
- US20080303427A1 HOLE TRANSPORT MATERIALS Public/Granted day:2008-12-11
Information query
IPC分类: