发明授权
- 专利标题: Semiconductor device and method of forming the same
- 专利标题(中): 半导体器件及其形成方法
-
申请号: US13287295申请日: 2011-11-02
-
公开(公告)号: US09012983B2公开(公告)日: 2015-04-21
- 发明人: Teruyuki Mine
- 申请人: Teruyuki Mine
- 申请人地址: LU Luxembourg
- 专利权人: PS4 Luxco S.a.r.l.
- 当前专利权人: PS4 Luxco S.a.r.l.
- 当前专利权人地址: LU Luxembourg
- 代理机构: Sughrue Mion, PLLC
- 优先权: JP2010-248769 20101105
- 主分类号: H01L27/108
- IPC分类号: H01L27/108 ; H01L29/78 ; H01L21/762 ; H01L29/10 ; H01L29/423
摘要:
A semiconductor device includes the following elements. A semiconductor substrate has a device formation region. The device formation region is defined by first and second device isolation regions which extend in first and second directions, respectively. The device formation region has a first gate groove which extends in the second direction. A first gate insulating film is disposed in a lower portion of the first gate groove. A first gate electrode is disposed on the first gate insulating film. The first gate electrode is disposed in the lower portion of the first gate groove. A buried insulating film is disposed over the first gate electrode. The buried insulating film is disposed in an upper portion of the first gate groove.
公开/授权文献
- US20120112258A1 SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME 公开/授权日:2012-05-10
信息查询
IPC分类: