发明授权
- 专利标题： Semiconductor packages and methods for producing the same
- 专利标题（中）： 半导体封装及其制造方法
-
申请号： US13348531申请日： 2012-01-11
-
公开(公告)号： US09013890B2公开(公告)日： 2015-04-21
- 发明人: Udo Ausserlechner , Carsten von Koblinski , Sigrid Wabnig , Volker Strutz , Robert Grünberger
- 申请人： Udo Ausserlechner , Carsten von Koblinski , Sigrid Wabnig , Volker Strutz , Robert Grünberger
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H05K7/00
- IPC分类号： H05K7/00 ; G01R15/20 ; G01R33/07 ; H01L23/16 ; H01L23/31 ; H01L23/00
摘要：
In one embodiment, a semiconductor package includes an isolating container having a recess, which forms an inner membrane portion and an outer rim portion. The rim portion is thicker than the membrane portion. The package includes a semiconductor chip disposed in the recess and a backplane disposed under the membrane portion of the isolating container.