Invention Grant
US09016837B2 Ink jet printhead device with compressive stressed dielectric layer
有权
具有压应力介质层的喷墨打印头装置
- Patent Title: Ink jet printhead device with compressive stressed dielectric layer
- Patent Title (中): 具有压应力介质层的喷墨打印头装置
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Application No.: US13893482Application Date: 2013-05-14
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Publication No.: US09016837B2Publication Date: 2015-04-28
- Inventor: Madanagopal Kunnavakkam , Teck Khim Neo , Kenneth W. Smiley
- Applicant: STMicroelectronics Asia Pacific Pte. Ltd. , STMicroelectronics, Inc.
- Applicant Address: US TX Coppell SG Singapore
- Assignee: STMicroelectronics, Inc.,STMicroelectronics Asia Pacific Pte. Ltd.
- Current Assignee: STMicroelectronics, Inc.,STMicroelectronics Asia Pacific Pte. Ltd.
- Current Assignee Address: US TX Coppell SG Singapore
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- Main IPC: B41J2/05
- IPC: B41J2/05 ; B41J2/14 ; B41J2/16

Abstract:
An ink jet printhead device includes a substrate and at least one first dielectric layer above the substrate. A resistive layer is above the at least one first dielectric layer. An electrode layer is above the resistive layer and defines first and second electrodes coupled to the resistive layer. At least one second dielectric layer is above the electrode layer and contacts the resistive layer through the at least one opening. The at least one second dielectric layer has a compressive stress magnitude of at least 340 MPa.
Public/Granted literature
- US20140340450A1 INK JET PRINTHEAD DEVICE WITH COMPRESSIVE STRESSED DIELECTRIC LAYER Public/Granted day:2014-11-20
Information query
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