Invention Grant
- Patent Title: Integrated optical cooling core for optoelectronic interconnect modules
- Patent Title (中): 用于光电互连模块的集成光学冷却芯
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Application No.: US14294167Application Date: 2014-06-03
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Publication No.: US09016957B2Publication Date: 2015-04-28
- Inventor: Ori Ben David , Avner Badihi , Mordi Farkash , Kfir Katz
- Applicant: Mellanox Technologies Ltd.
- Applicant Address: IL Yokneam
- Assignee: Mellanox Technologies Ltd.
- Current Assignee: Mellanox Technologies Ltd.
- Current Assignee Address: IL Yokneam
- Agency: D Kligler I.P. Services Ltd
- Main IPC: G02B6/36
- IPC: G02B6/36 ; G02B6/42

Abstract:
An apparatus includes one or more optoelectronic transducers, driving circuitry, one or more cooling elements, and a light coupling module. The optoelectronic transducers are configured to convert between optical signals conveyed over optical fibers and respective electrical signals. The driving circuitry is configured to process the electrical signals. The cooling elements are configured to remove heat that is produced at least by the driving circuitry. The light coupling module is configured to couple the optical signals between the optical fibers and the optoelectronic transducers, and additionally serves as a baseplate for the cooling elements.
Public/Granted literature
- US20140369651A1 INTEGRATED OPTICAL COOLING CORE FOR OPTOELECTRONIC INTERCONNECT MODULES Public/Granted day:2014-12-18
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