发明授权
- 专利标题： Substrate for wallboard joint tape and process for making same
- 专利标题（中）： 墙板接缝胶带基材及其制造方法
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申请号： US13552959申请日： 2012-07-19
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公开(公告)号： US09017803B2公开(公告)日： 2015-04-28
- 发明人: Dennis W. Anderson , James E. Sealey
- 申请人： Dennis W. Anderson , James E. Sealey
- 申请人地址： US TN Memphis
- 专利权人： International Paper Company
- 当前专利权人： International Paper Company
- 当前专利权人地址： US TN Memphis
- 代理商 Thomas W. Barnes, III
- 主分类号： E04F13/04
- IPC分类号： E04F13/04 ; D21H27/32 ; B32B7/02 ; B32B29/00 ; D21H27/20
摘要：
A multi-ply paper substrate is provided, which comprises at least two plies bonded to one another by an adhesive; a basis weight of 80-200 gsm; an internal bond of 10-180 milli-ft.-lb/sq. in. as measured by TAPPI method 541; an MD tensile of 20-300 lbf/inch width as measured by TAPPI method 494; and a CD tensile of 10-300 lbf/inch width as measured by TAPPI method 494. Methods of making and using the paper substrate, products made therefrom, and uses of the paper substrate are also provided.
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