Invention Grant
- Patent Title: Method for fabricating a chip having a water-repellent obverse surface and a hydrophilic reverse surface
- Patent Title (中): 用于制造具有防水表面和亲水反面的芯片的方法
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Application No.: US14090198Application Date: 2013-11-26
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Publication No.: US09018042B2Publication Date: 2015-04-28
- Inventor: Hidekazu Arase , Tomoyuki Komori
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2012-073191 20120328
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/31 ; H01L21/56 ; H01L21/683
Abstract:
In order to provide a novel method for producing a chip having a water-repellent obverse surface and a hydrophilic reverse surface, the characteristic of the present disclosure lies in that the obverse surface of the chip having a hydroxyl group is brought into contact with an organic solvent in which R1—Si(OR2)3 or R1—SiY3 is dissolved in a second hydrophobic solvent, while the reverse surface of the chip is protected by the water film, so as to form a water-repellent film on the obverse surface of the chip.
Public/Granted literature
- US20140080261A1 METHOD FOR FABRICATING A CHIP HAVING A WATER-REPELLENT OBVERSE SURFACE AND A HYDROPHILIC REVERSE SURFACE Public/Granted day:2014-03-20
Information query
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