发明授权
- 专利标题: Encapsulated metal interconnect
- 专利标题(中): 封装金属互连
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申请号: US13629402申请日: 2012-09-27
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公开(公告)号: US09018092B2公开(公告)日: 2015-04-28
- 发明人: John H. Zhang , Lawrence A. Clevenger , Carl Radens , Yiheng Xu
- 申请人: STMicroelectronics, Inc. , International Business Machines Corporation
- 申请人地址: US TX Coppell US NY Armonk
- 专利权人: STMicroelectronics, Inc.,International Business Machines Corporation
- 当前专利权人: STMicroelectronics, Inc.,International Business Machines Corporation
- 当前专利权人地址: US TX Coppell US NY Armonk
- 代理机构: Seed IP Law Group
- 主分类号: H01L21/4763
- IPC分类号: H01L21/4763 ; H01L21/44 ; H01L21/768
摘要:
A plurality of metal tracks are formed in an integrated circuit die in three metal layers stacked within the die. A protective dielectric layer is formed around metal tracks of an intermediate metal layer. The protective dielectric layer acts as a hard mask to define contact vias between metal tracks in the metal layers above and below the intermediate metal layer.
公开/授权文献
- US20140084465A1 SYSTEM AND METHOD OF NOVEL MX TO MX-2 公开/授权日:2014-03-27