Invention Grant
US09018343B2 Polyamide-imide copolymer film and method of preparing polyamide-imide copolymer
有权
聚酰胺酰亚胺共聚物膜及聚酰胺 - 酰亚胺共聚物的制备方法
- Patent Title: Polyamide-imide copolymer film and method of preparing polyamide-imide copolymer
- Patent Title (中): 聚酰胺酰亚胺共聚物膜及聚酰胺 - 酰亚胺共聚物的制备方法
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Application No.: US14347895Application Date: 2012-09-27
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Publication No.: US09018343B2Publication Date: 2015-04-28
- Inventor: Hyo Jun Park , Hak Gee Jung
- Applicant: Kolon Industries, Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: Kolon Industries, Inc.
- Current Assignee: Kolon Industries, Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2011-0100151 20110930
- International Application: PCT/KR2012/007784 WO 20120927
- International Announcement: WO2013/048126 WO 20130404
- Main IPC: C08G69/26
- IPC: C08G69/26 ; C08G73/14 ; C08L79/08 ; C08G73/10 ; G02F1/1337
Abstract:
Disclosed herein is a polyamide-imide copolymer film, comprising a copolymer resin in which a unit structure derived from TFDB (2,2′-bistrifluoromethyl-4,4′-biphenyl diamine), a unit structure derived from 6FDA (4,4′-(hexa-fluoroisopropylidene)diphthalic anhydride), a unit structure derived from BPDA (3,3′,4,4′-biphenyltetracarboxylic dianhydride) and a unit structure derived from TPC (terephthaloyl chloride or 1,4-benzenedicarbonyl chloride) are copolymerized, wherein the copolymer resin has a weight average molecular weight of 10,000˜400,000.
Public/Granted literature
- US20140243482A1 POLYAMIDE-IMIDE COPOLYMER FILM AND METHOD OF PREPARING POLYAMIDE-IMIDE COPOLYMER Public/Granted day:2014-08-28
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