Invention Grant
US09019056B2 Coil component, mounting structure thereof, and electronic device including the same
有权
线圈部件,其安装结构以及包括该线圈部件的电子设备
- Patent Title: Coil component, mounting structure thereof, and electronic device including the same
- Patent Title (中): 线圈部件,其安装结构以及包括该线圈部件的电子设备
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Application No.: US13611767Application Date: 2012-09-12
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Publication No.: US09019056B2Publication Date: 2015-04-28
- Inventor: Duck Jin An , Ki Hung Nam , Soon Young Kwon , Myeong Sik Cheon
- Applicant: Duck Jin An , Ki Hung Nam , Soon Young Kwon , Myeong Sik Cheon
- Applicant Address: KR Suwon, Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon, Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2012-0070877 20120629
- Main IPC: H01F27/30
- IPC: H01F27/30 ; H01F27/29 ; H01F5/04 ; H01F5/02 ; H01F27/02 ; H01F27/32

Abstract:
Disclosed are a coil component capable of securing insulation between primary and secondary coils while being miniaturized, a mounting structure thereof, and an electronic device having the same. The coil component includes a bobbin including a winding part around which coils are wound and first terminal fastening parts fastened to a plurality of first connection terminals; and a second terminal fastening part including terminal blocks protruded from the bobbin and a plurality of second connection terminals fastened to the terminal blocks, wherein the second terminal fastening part is mounted on a substrate while being spaced apart from the bobbin after the coils are wound therearound.
Public/Granted literature
- US20140002224A1 COIL COMPONENT, MOUNTING STRUCTURE THEREOF, AND ELECTRONIC DEVICE INCLUDING THE SAME Public/Granted day:2014-01-02
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