Invention Grant
US09021690B2 Method of manufacturing printed circuit board having buried solder bump
有权
制造具有埋焊料凸块的印刷电路板的方法
- Patent Title: Method of manufacturing printed circuit board having buried solder bump
- Patent Title (中): 制造具有埋焊料凸块的印刷电路板的方法
-
Application No.: US13137756Application Date: 2011-09-09
-
Publication No.: US09021690B2Publication Date: 2015-05-05
- Inventor: Myung Sam Kang
- Applicant: Myung Sam Kang
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2008-0112359 20081112
- Main IPC: H01R9/00
- IPC: H01R9/00 ; H05K1/11 ; H05K3/20 ; H05K3/34 ; H05K3/28
Abstract:
A method of manufacturing a printed circuit board having a buried solder bump, including: preparing a carrier on which a circuit layer, a solder bump, and a circuit pattern formed on the solder bump are formed; pressing the carrier into an insulating layer so that the circuit layer, the solder bump and the circuit pattern are buried in the insulating layer; and removing the carrier.
Public/Granted literature
- US20120005886A1 Method of manufacturing printed circuit board having buried solder bump Public/Granted day:2012-01-12
Information query
