An optical communication apparatus includes a PCB, a photoelectric element, a driver chip, and a light waveguide. The PCB defines a groove in a surface thereof. The groove includes a bottom surface and a side surface connected to the bottom surface. The PCB includes a reflecting layer coated on the side surface. The photoelectric element includes an optical portion for emitting/receiving light carrying optical signals. An optical signal emitting/receiving direction of the photoelectric element is substantially perpendicular to the surface of the PCB. The side surface passes through a projection area of the optical portion along a direction substantially perpendicular to the surface of the PCB. An end of the light waveguide is positioned on the bottom surface of the groove and is out of the projection area of the optical portion. The reflecting layer couples optical signals between the photoelectric element and the light waveguide.