Invention Grant
US09028098B2 LED component, LED module and method for manufacturing the LED component
有权
LED组件，LED模块和LED组件的制造方法
- Patent Title: LED component, LED module and method for manufacturing the LED component
- Patent Title (中): LED组件，LED模块和LED组件的制造方法
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Application No.: US14090312Application Date: 2013-11-26
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Publication No.: US09028098B2Publication Date: 2015-05-12
- Inventor: Po-Wei Li
- Applicant: Lite-On Opto Technology (Changzhou) Co., Ltd. , Lite-On Technology Corp.
- Applicant Address: CN Jiangau Province TW Taipei
- Assignee: Lite-On Opto Technology (Changzhou) Co., Ltd.,Lite-On Technology Corp.
- Current Assignee: Lite-On Opto Technology (Changzhou) Co., Ltd.,Lite-On Technology Corp.
- Current Assignee Address: CN Jiangau Province TW Taipei
- Agency: Rosenberg, Klein & Lee
- Priority: CN201210501483 20121129
- Main IPC: F21V23/00
- IPC: F21V23/00 ; H05K3/32 ; F21K99/00 ; H05K1/11 ; H05K3/40 ; F21V3/00 ; F21Y101/02 ; F21Y103/02 ; F21Y105/00 ; F21Y111/00 ; H05K1/18
Abstract:
A light emitting diode (LED) component includes a base having a main body and a wiring pattern. The main body defines an axis and includes two connecting surfaces respectively located at two opposite sides thereof, and a plurality of interconnected mounting surfaces surrounding the axis and connected between the connecting surfaces. The wiring pattern is at least disposed on the mounting surfaces and includes electrically insulated anode and cathode. A plurality of light emitting diode (LED) chips are disposed on the mounting surfaces. Each LED chip is electrically connected to the anode and the cathode.
Public/Granted literature
- US20140146536A1 LED COMPONENT, LED MODULE AND METHOD FOR MANUFACTURING THE LED COMPONENT Public/Granted day:2014-05-29
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