A multi-chip package may include first and second integrated circuit dies that are each partitioned into multiple logic regions. The logic regions of the first and second dies may be coupled via interconnects. Each integrated circuit die may include at least one spare logic region. Multiple logic groups may be formed with each logic group including logic regions from the first and second integrated circuit dies and the interconnects that couple those logic regions. The logic groups may be evaluated to identify defective logic groups. In response to identifying a defective logic group, the defective logic group may be repaired by configuring the first and second integrated circuit dies to stop using the defective logic group and to use a spare logic group. The spare logic group may include spare logic regions of the first and second dies that are coupled by spare logic region interconnects.