Invention Grant
- Patent Title: Ultrasonic measurement apparatus and method
- Patent Title (中): 超声波测量装置及方法
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Application No.: US13658392Application Date: 2012-10-23
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Publication No.: US09032801B2Publication Date: 2015-05-19
- Inventor: Roman Heinrich Koch , Gerhard Finger , Heiko Martin Franz Sackenreuther
- Applicant: General Electric Company
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Hiscock & Barclay LLP
- Main IPC: G01N29/04
- IPC: G01N29/04 ; G01B17/02

Abstract:
A method and apparatus for determining a thickness of an object using ultrasonic signals are disclosed. The method includes the steps of transmitting ultrasonic signals toward the object, digitizing a reflected echo sequence of the ultrasonic signals, including interpolating the echo sequence, and processing the echo sequence by detecting maximum amplitude peaks in the echo sequence and determining the object thickness based on a time duration between the maximum amplitude peaks.
Public/Granted literature
- US20140109677A1 ULTRASONIC MEASUREMENT APPARATUS AND METHOD Public/Granted day:2014-04-24
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