Invention Grant
- Patent Title: Microelectromechanical load sensor and methods of manufacturing the same
- Patent Title (中): 微机电负载传感器及其制造方法
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Application No.: US13934900Application Date: 2013-07-03
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Publication No.: US09032818B2Publication Date: 2015-05-19
- Inventor: Ian Campbell , Ryan Diestelhorst
- Applicant: NextInput, Inc.
- Applicant Address: US GA Atlanta
- Assignee: NextInput, Inc.
- Current Assignee: NextInput, Inc.
- Current Assignee Address: US GA Atlanta
- Agency: Meunier Carlin & Curfman, LLC
- Main IPC: G01L1/22
- IPC: G01L1/22 ; G01L1/18 ; B81B3/00 ; B81C1/00 ; G01L1/14 ; G01L1/26 ; G01L5/16

Abstract:
A microelectromechanical (“MEMS”) load sensor device for measuring a force applied by a human user is described herein. In one aspect, the load sensor device has a contact surface in communication with a touch surface which communicates forces originating on the touch surface to a deformable membrane, on which load sensor elements are arranged, such that the load sensor device produces a signal proportional to forces imparted by a human user along the touch surface. In another aspect, the load sensor device has an overload protection ring to protect the load sensor device from excessive forces. In another aspect, the load sensor device has embedded logic circuitry to allow a microcontroller to individually address load sensor devices organized into an array. In another aspect, the load sensor device has electrical and mechanical connectors such as solder bumps designed to minimize cost of final component manufacturing.
Public/Granted literature
- US20140007705A1 MICROELECTROMECHANICAL LOAD SENSOR AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2014-01-09
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