Invention Grant
US09034149B2 Method for fabricating a high coercivity hard bias structure for magnetoresistive sensor
有权
用于制造用于磁阻传感器的高矫顽力硬偏置结构的方法
- Patent Title: Method for fabricating a high coercivity hard bias structure for magnetoresistive sensor
- Patent Title (中): 用于制造用于磁阻传感器的高矫顽力硬偏置结构的方法
-
Application No.: US12387377Application Date: 2009-05-01
-
Publication No.: US09034149B2Publication Date: 2015-05-19
- Inventor: Min Zheng , Kunliang Zhang , Min Li
- Applicant: Min Zheng , Kunliang Zhang , Min Li
- Applicant Address: US CA Milpitas
- Assignee: Headway Technologies, Inc.
- Current Assignee: Headway Technologies, Inc.
- Current Assignee Address: US CA Milpitas
- Agency: Saile Ackerman LLC
- Agent Stephen B. Ackerman
- Main IPC: C23C14/58
- IPC: C23C14/58 ; C23C14/14 ; C23C14/02 ; G01R33/09 ; G11B5/31 ; G11B5/39

Abstract:
A hard bias (HB) structure for longitudinally biasing a free layer in a MR sensor is disclosed that includes a mildly etched seed layer and a hard bias (HB) layer on the etched seed layer. The HB layer may contain one or more HB sub-layers stacked on a lower sub-layer which contacts the etched seed layer. Each HB sub-layer is mildly etched before depositing another HB sub-layer thereon. The etch may be performed in an IBD chamber and creates a higher concentration of nucleation sites on the etched surface thereby promoting a smaller HB average grain size than would be realized with no etch treatments. A smaller HB average grain size is responsible for increasing Hcr in a CoPt HB layer to as high as 2500 to 3000 Oe. Higher Hcr is achieved without changing the seed layer or HB material and without changing the thickness of the aforementioned layers.
Public/Granted literature
- US20100276272A1 Method for fabricating a high coercivity hard bias structure for magnetoresistive sensor Public/Granted day:2010-11-04
Information query
IPC分类: