Invention Grant
- Patent Title: Stretchable electronic device and method of manufacturing same
- Patent Title (中): 可拉伸电子装置及其制造方法
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Application No.: US13840299Application Date: 2013-03-15
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Publication No.: US09040337B2Publication Date: 2015-05-26
- Inventor: Chan Woo Park , Jae Bon Koo , Sang Chul Lim , Ji-Young Oh , Soon-Won Jung
- Applicant: Electronics and Telecommunications Research Institute
- Applicant Address: KR Daejeon
- Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee Address: KR Daejeon
- Priority: KR10-2012-0115432 20121017
- Main IPC: H01L21/76
- IPC: H01L21/76 ; H05K1/02 ; H01L21/768 ; H01L23/538 ; H05K3/46
Abstract:
Provided are a stretchable electronic device and a method of manufacturing the same. The manufacturing method includes forming coil interconnection on a first substrate, forming a first stretchable insulating layer that covers the coil interconnection, forming a second substrate on the first stretchable insulating layer, separating the first substrate from the coiling interconnection and the first stretchable insulating layer, and forming a transistor on the coil interconnection.
Public/Granted literature
- US20140104793A1 STRETCHABLE ELECTRONIC DEVICE AND METHOD OF MANUFACTURING SAME Public/Granted day:2014-04-17
Information query
IPC分类:
