Invention Grant
US09040344B2 Method for fabricating array substrate, array substrate and display device
有权
阵列基板，阵列基板和显示装置的制造方法
- Patent Title: Method for fabricating array substrate, array substrate and display device
- Patent Title (中): 阵列基板，阵列基板和显示装置的制造方法
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Application No.: US13984090Application Date: 2012-12-13
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Publication No.: US09040344B2Publication Date: 2015-05-26
- Inventor: Seungjin Choi , Heecheol Kim , Youngsuk Song , Seongyeol Yoo
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Ladas & Parry LLP
- Priority: CN201210254735 20120720
- International Application: PCT/CN2012/086597 WO 20121213
- International Announcement: WO2014/012334 WO 20140123
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L27/12 ; H01L29/786
Abstract:
A method for fabricating array substrate, an array substrate and a display device. The method for fabricating the array substrate comprises forming a thin film transistor, a first transparent electrode (14) and a second transparent electrode (19), wherein a multi dimensional electric field is created by the first transparent electrode (17) and the second transparent electrode (19), wherein forming the first transparent electrode (17) comprises: forming a metal oxide film presenting semiconductor properties; forming the first transparent electrode (17) by subjecting a portion of the metal oxide film to metallization treatment, and forming a semiconductor active layer (141) from a portion which is not subjected to the metallization treatment.
Public/Granted literature
- US20140167031A1 METHOD FOR FABRICATING ARRAY SUBSTRATE, ARRAY SUBSTRATE AND DISPLAY DEVICE Public/Granted day:2014-06-19
Information query
IPC分类:
