利索-全球专利检索

  1. 登录
  2. 注册
发明授权
US09040842B2 Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers 有权
通过部分固化的环氧树脂填料，铜金属化对电介质的机械附着力

Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers
摘要：
In some embodiments, an improved mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers is presented. In this regard, a substrate build-up film is introduced having epoxy material and a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured. Other embodiments are also disclosed and claimed.
摘要（中）：

在一些实施方案中，提出了铜金属化与具有部分固化的环氧树脂填料的电介质的改进的机械粘附。 在这方面，引入具有环氧树脂材料和多个环氧微球的衬底累积膜，其中微球的内部未完全固化。 还公开并要求保护其他实施例。

公开/授权文献
信息查询
Espacenet
0/0