发明授权
US09040952B2 Semiconductor device and method of fabricating the same 有权
半导体装置及其制造方法

  • 专利标题: Semiconductor device and method of fabricating the same
  • 专利标题(中): 半导体装置及其制造方法
  • 申请号: US14044752
    申请日: 2013-10-02
  • 公开(公告)号: US09040952B2
    公开(公告)日: 2015-05-26
  • 发明人: Taejung Ha
  • 申请人: SK Hynix Inc.
  • 申请人地址: KR Icheon
  • 专利权人: SK HYNIX INC.
  • 当前专利权人: SK HYNIX INC.
  • 当前专利权人地址: KR Icheon
  • 主分类号: H01L45/00
  • IPC分类号: H01L45/00
Semiconductor device and method of fabricating the same
摘要:
A semiconductor device includes a first conductive layer extending in a first direction, a second conductive layer extending in a second direction and disposed over the first conductive layer, the first and second directions being substantially perpendicular to each other, and a variable resistance layer disposed over the first conductive layer, the variable resistance layer extending in the second direction. An upper portion of the variable resistance layer is disposed between lower portions of two neighboring second conductive layers including the second conductive layer.
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