发明授权
- 专利标题： Ultraviolet light emitting diode package
- 专利标题（中）： 紫外线发光二极管封装
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申请号： US14063078申请日： 2013-10-25
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公开(公告)号： US09041037B2公开(公告)日： 2015-05-26
- 发明人: Jeong Suk Bae , Jae Jo Kim , Do Hyung Kim , Dae Sung Kal
- 申请人： Seoul Viosys Co., Ltd.
- 申请人地址： KR Ansan-si
- 专利权人： Seoul Viosys Co., Ltd.
- 当前专利权人： Seoul Viosys Co., Ltd.
- 当前专利权人地址： KR Ansan-si
- 代理机构： H.C. Park & Associates, PLC
- 优先权： KR10-2006-0094917 20060928; KR10-2006-0095847 20060929; KR10-2006-0095849 20060929
- 主分类号： H01L33/00
- IPC分类号： H01L33/00 ; H01L33/60 ; H01L33/56 ; H01L25/075 ; H01L33/64
摘要：
An ultraviolet light emitting diode package for emitting ultraviolet light is disclosed. The ultraviolet light emitting diode package comprises an LED chip emitting light with a peak wavelength of 350 nm or less, and a protective member provided so that surroundings of the LED chip is covered to protect the LED chip, the protective member having a non-yellowing property to energy from the LED chip.
公开/授权文献
- US20140061706A1 ULTRAVIOLET LIGHT EMITTING DIODE PACKAGE 公开/授权日：2014-03-06
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