发明授权
- 专利标题: High electron mobility transistors and methods of manufacturing the same
- 专利标题(中): 高电子迁移率晶体管及其制造方法
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申请号: US13064287申请日: 2011-03-16
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公开(公告)号: US09041063B2公开(公告)日: 2015-05-26
- 发明人: In-jun Hwang
- 申请人: In-jun Hwang
- 申请人地址: KR
- 专利权人: SAMSUNG ELECTRONCS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONCS CO., LTD.
- 当前专利权人地址: KR
- 代理机构: Harness, Dickey & Pierce, PLC
- 优先权: KR10-2010-0042069 20100504
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; H01L29/778 ; H01L29/10 ; H01L29/423 ; H01L29/20
摘要:
High electron mobility transistors (HEMTs) and methods of manufacturing the same. A HEMT may include a source electrode, a gate electrode, a drain electrode, a channel formation layer including at least a 2-dimensional electron gas (2DEG) channel, a channel supplying layer for forming the 2DEG channel in the channel formation layer, a portion of the channel supplying layer including a first oxygen treated region. The channel supplying layer may include a second oxygen treated region that extends from the first oxygen treated region towards the drain electrode, and the depth and concentration of oxygen of the second oxygen treated region may be less than those of the first oxygen treated region.
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