Invention Grant
US09041087B2 Semiconductor devices having dielectric caps on contacts and related fabrication methods 有权
具有接触电介质盖的半导体器件和相关的制造方法

Semiconductor devices having dielectric caps on contacts and related fabrication methods
Abstract:
Semiconductor device structures are provided. An exemplary semiconductor device structure includes a substrate of a semiconductor material and a gate structure overlying the substrate. The semiconductor substrate further includes a doped region formed in the substrate proximate the gate structure and a first dielectric material overlying the doped region. The semiconductor substrate also includes a conductive contact formed in the first dielectric material, the conductive contact being electrically connected to the doped region, and a dielectric cap overlying the conductive contact.
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