Invention Grant
US09041087B2 Semiconductor devices having dielectric caps on contacts and related fabrication methods
有权
具有接触电介质盖的半导体器件和相关的制造方法
- Patent Title: Semiconductor devices having dielectric caps on contacts and related fabrication methods
- Patent Title (中): 具有接触电介质盖的半导体器件和相关的制造方法
-
Application No.: US14288034Application Date: 2014-05-27
-
Publication No.: US09041087B2Publication Date: 2015-05-26
- Inventor: Lei Yuan , Jin Cho , Jongwook Kye
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES, INC.
- Current Assignee: GLOBALFOUNDRIES, INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L23/48 ; H01L21/4763 ; H01L29/423 ; H01L23/485 ; H01L21/8234 ; H01L21/768 ; H01L29/78

Abstract:
Semiconductor device structures are provided. An exemplary semiconductor device structure includes a substrate of a semiconductor material and a gate structure overlying the substrate. The semiconductor substrate further includes a doped region formed in the substrate proximate the gate structure and a first dielectric material overlying the doped region. The semiconductor substrate also includes a conductive contact formed in the first dielectric material, the conductive contact being electrically connected to the doped region, and a dielectric cap overlying the conductive contact.
Public/Granted literature
- US20140264499A1 SEMICONDUCTOR DEVICES HAVING DIELECTRIC CAPS ON CONTACTS AND RELATED FABRICATION METHODS Public/Granted day:2014-09-18
Information query
IPC分类: