Invention Grant
- Patent Title: Metal-insulator-metal capacitor structures
- Patent Title (中): 金属 - 绝缘体 - 金属电容器结构
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Application No.: US13917549Application Date: 2013-06-13
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Publication No.: US09041148B2Publication Date: 2015-05-26
- Inventor: Renatas Jakushokas , Vaishnav Srinivas , Robert Won Chol Kim
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L49/02 ; H01L23/522 ; H01L27/08 ; H01G4/33 ; H01G4/38 ; H01G4/002

Abstract:
Capacitor structures capable of providing both low-voltage capacitors and high-voltage capacitors are described herein. In one embodiment, a capacitor structure comprises a low-voltage capacitor and a high-voltage capacitor. The low-voltage capacitor comprises a first electrode formed from a first metal layer, a second electrode formed from a second metal layer, a third electrode formed from a third metal layer, a first dielectric layer between the first and second electrodes, and a second dielectric layer between the second and third electrodes. The high-voltage capacitor comprises a fourth electrode formed from the first metal layer, a fifth electrode formed from the third metal layer, and a third dielectric layer between the fourth and fifth electrodes, wherein the third dielectric layer is thicker than either the first dielectric layer or the second dielectric layer.
Public/Granted literature
- US20140367757A1 METAL-INSULATOR-METAL CAPACITOR STRUCTURES Public/Granted day:2014-12-18
Information query
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