发明授权
- 专利标题： Laminate interconnect having a coaxial via structure
- 专利标题（中）： 具有同轴通孔结构的层压互连
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申请号： US13287194申请日： 2011-11-02
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公开(公告)号： US09041208B2公开(公告)日： 2015-05-26
- 发明人: Adam Gallegos , Mark Hinton , Nurwati Suwendi Devnani , John Connor
- 申请人： Adam Gallegos , Mark Hinton , Nurwati Suwendi Devnani , John Connor
- 申请人地址： SG Singapore
- 专利权人： Avago Technologies General IP (Singapore) Pte. Ltd.
- 当前专利权人： Avago Technologies General IP (Singapore) Pte. Ltd.
- 当前专利权人地址： SG Singapore
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H05K1/02 ; H01L21/48 ; H05K3/46 ; H01L23/00
摘要：
A laminate interconnect structure includes a core material and at least one additional layer adjacent the core material, a first electrically conductive via formed in the core material, and a second electrically conductive via formed in the core material, coaxial with the first electrically conductive via and separated from the first electrically conductive via by a non-conductive material.
公开/授权文献
- US20130105987A1 LAMINATE INTERCONNECT HAVING A COAXIAL VIA STRUCTURE 公开/授权日：2013-05-02
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