发明授权
- 专利标题： Molding compound including a carbon nano-tube dispersion
- 专利标题（中）： 包含碳纳米管分散体的成型化合物
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申请号： US12343398申请日： 2008-12-23
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公开(公告)号： US09041228B2公开(公告)日： 2015-05-26
- 发明人: Myung Jin Yim , Jason Brand
- 申请人： Myung Jin Yim , Jason Brand
- 申请人地址： US ID Boise
- 专利权人： Micron Technology, Inc.
- 当前专利权人： Micron Technology, Inc.
- 当前专利权人地址： US ID Boise
- 代理机构： Schwegman Lundberg & Woessner, P.A.
- 主分类号： H01L23/28
- IPC分类号： H01L23/28 ; H01L23/29 ; H01L23/31 ; H01L23/00
摘要：
A molding compound comprising a resin, a filler, and a carbon nano-tube dispersion is disclosed. The carbon nano-tube dispersion achieves a low average agglomeration size in the molding compound thereby providing desirable electromechanical properties and laser marking compatibility. A shallow laser mark may be formed in a mold cap with a maximum depth of less than 10 microns.
公开/授权文献
- US20100155934A1 MOLDING COMPOUND INCLUDING A CARBON NANO-TUBE DISPERSION 公开/授权日：2010-06-24
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