Invention Grant
- Patent Title: Attenuation reduction control structure for high-frequency signal transmission lines of flexible circuit board
- Patent Title (中): 柔性电路板高频信号传输线衰减控制结构
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Application No.: US14108838Application Date: 2013-12-17
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Publication No.: US09041482B2Publication Date: 2015-05-26
- Inventor: Gwun-Jin Lin , Kuo-Fu Su , Chih-Heng Chuo
- Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
- Applicant Address: TW Taoyuan County
- Assignee: Advanced Flexible Circuits Co., Ltd.
- Current Assignee: Advanced Flexible Circuits Co., Ltd.
- Current Assignee Address: TW Taoyuan County
- Agency: Rosenberg, Klein & Lee
- Priority: TW102121670A 20130619
- Main IPC: H03H7/38
- IPC: H03H7/38 ; H01P1/22 ; H01P3/02 ; H05K1/00

Abstract:
An attenuation reduction control structure for high-frequency signal transmission lines of a flexible circuit board includes an impedance control layer formed on a surface of a substrate. The impedance control layer includes an attenuation reduction pattern that is arranged in an extension direction of the high-frequency signal transmission lines of the substrate and corresponds to bottom angle structures of the high-frequency signal transmission lines in order to improve attenuation of a high-frequency signal transmitted through the high-frequency signal transmission lines. An opposite surface of the substrate includes a conductive shielding layer formed thereon. The conductive shielding layer is formed with an attenuation reduction pattern corresponding to top angle structures of the high-frequency signal transmission lines.
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